The **ATS-08G-32-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for securing cooling solutions directly to Printed Circuit Boards (PCBs). ### Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-08G-32-C2-R0 | | **Type** | Top Mount / Push-Pin Heat Sink | | **Fin Style** | Straight Fin | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 14.50mm | | **Thermal Resistance** | 21.46°C/W (Natural Convection) | | **Attachment Method** | Push-Pin (Plastic) with Spring | --- ### Component Breakdown #### 1. Heat Sink Body The body is constructed from aluminum for its high thermal conductivity-to-weight ratio. The **Blue Anodized** finish is not just aesthetic; it provides surface protection and slightly improves emissivity, which aids in radiant heat transfer. #### 2. Thermal Interface Material (TIM) The "C2" in the part number indicates that this unit comes pre-applied with **ATS-PPS-08** or a similar high-performance Phase Change Material (PCM). This fills the microscopic air gaps between the component (CPU/FPGA) and the heat sink to ensure efficient heat transfer. #### 3. Attachment Mechanism: Push-Pins Instead of using adhesive tape, this model uses a **plastic push-pin and brass spring system**: * **Pressure:** The springs provide a precise "engagement force" to ensure the heat sink remains flat against the chip. * **Stability:** This method is preferred in high-vibration environments compared to thermal tape. * **Compatibility:** Requires pre-drilled holes in the PCB. --- ### Performance Overview (Airflow vs. Resistance) The cooling efficiency of the ATS-08G-32-C2-R0 scales with the velocity of the air moving through its fins: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 11.77 | | 400 (2.0 m/s) | 7.51 | | 600 (3.0 m/s) | 5.81 | | 800 (4.0 m/s) | 5.03 | ### Applications * **Integrated Circuits (ICs):** Cooling for BGA (Ball Grid Array) packages. * **Processing Units:** Mid-range FPGAs, ASICs, and small CPUs. * **Power Electronics:** Heat dissipation for VRMs (Voltage Regulator Modules).