The **ATS-08G-33-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for efficient heat dissipation from integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Product Type** | Heat Sink | | **Material** | Aluminum | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Fin Type** | Cross-Cut (Grid) | | **Dimensions (LxWxH)** | 36.83mm x 36.83mm x 17.78mm | | **Thermal Resistance** | 17.42°C/W (Unducted @ 100 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | | **Finish** | Blue Anodized | --- ### 2. Electronic/Physical Characteristics #### A. Thermal Performance The primary function of this part is to increase the surface area of a heat-generating component (like a CPU, FPGA, or MOSFET). The cross-cut fin design allows for multi-directional airflow, making it effective in systems where the direction of the cooling fan may not be perfectly aligned with the heat sink. #### B. Mounting System (pushPIN™) Unlike adhesive-based heat sinks, the **ATS-08G-33-C2-R0** uses a mechanical fastening system: * **Push Pins:** Durable plastic or brass pins that lock into pre-drilled holes on the PCB. * **Compression Springs:** These provide a precise, consistent "pull-down" force, ensuring the heat sink maintains optimal contact with the chip for maximum heat transfer. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This is a specialized paste or pad that fills microscopic air gaps between the component and the heat sink, significantly lowering thermal resistance. --- ### 3. Applications This part is typically used in medium-to-high density electronic environments: * **Embedded Systems:** Industrial PCs and controllers. * **Networking:** Routers, switches, and small-form-factor servers. * **Power Electronics:** Cooling voltage regulators or high-speed processors. ---