Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-08G-35-C2-R0

  • AI
    The **ATS-08G-35-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for efficient cooling of integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 35mm x 35mm | | **Height (H)** | 10mm | | **Pitch (Fins)** | Fine Pitch | | **Thermal Resistance** | 22.48 °C/W (Unducted @ 100 LFM) | | **Compliance** | RoHS and REACH Compliant | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by Advanced Thermal Solutions: 1. **ATS**: Manufacturer (Advanced Thermal Solutions). 2. **08**: Series designation. 3. **G**: Fin pattern/spacing (generally indicates a specific geometry). 4. **35**: Base dimension (35mm). 5. **C2**: Thermal Interface Material (T766) or specific mounting hardware configuration. 6. **R0**: Revision or specific packaging code. --- ### 3. Key Features * **pushPIN™ Attachment:** Uses a flexible attachment system that allows for easy installation and precise pressure to ensure optimal thermal contact. * **Fine Pitch Fin Design:** The "G" series geometry provides a high surface area within a small 35mm footprint, ideal for low-profile applications (10mm height). * **Pre-assembled:** Usually comes with a pre-applied Thermal Interface Material (TIM) and the required springs and pins for assembly. * **Optimized Airflow:** Designed to work efficiently in both natural convection and forced-air environments. --- ### 4. Common Applications This heat sink is typically found in: * **Networking Equipment:** Routers, switches, and high-speed modems. * **Embedded Systems:** Industrial PCs and small form-factor controllers. * **Power Supplies:** Cooling voltage regulators and power MOSFETs. * **Consumer Electronics:** High-performance TV boxes or gaming peripherals.
    ✨ Follow-up Questions
    • ⤷ What are the different types of pushPIN attachment options available for this series?
    • ⤷ How does the 'C2' thermal interface material compare to other ATS options?
    • ⤷ Can this heat sink be used for CPUs or GPUs with higher TDP?