ATS-08G-35-C2-R0
AI

The **ATS-08G-35-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for efficient cooling of integrated circuits (ICs) and other electronic components.
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### 1. Technical Specifications
The following table outlines the physical and thermal characteristics of this specific part:
| Characteristic | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W)** | 35mm x 35mm |
| **Height (H)** | 10mm |
| **Pitch (Fins)** | Fine Pitch |
| **Thermal Resistance** | 22.48 °C/W (Unducted @ 100 LFM) |
| **Compliance** | RoHS and REACH Compliant |
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### 2. Breakdown of the Part Number
The part number follows a specific nomenclature used by Advanced Thermal Solutions:
1. **ATS**: Manufacturer (Advanced Thermal Solutions).
2. **08**: Series designation.
3. **G**: Fin pattern/spacing (generally indicates a specific geometry).
4. **35**: Base dimension (35mm).
5. **C2**: Thermal Interface Material (T766) or specific mounting hardware configuration.
6. **R0**: Revision or specific packaging code.
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### 3. Key Features
* **pushPIN™ Attachment:** Uses a flexible attachment system that allows for easy installation and precise pressure to ensure optimal thermal contact.
* **Fine Pitch Fin Design:** The "G" series geometry provides a high surface area within a small 35mm footprint, ideal for low-profile applications (10mm height).
* **Pre-assembled:** Usually comes with a pre-applied Thermal Interface Material (TIM) and the required springs and pins for assembly.
* **Optimized Airflow:** Designed to work efficiently in both natural convection and forced-air environments.
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### 4. Common Applications
This heat sink is typically found in:
* **Networking Equipment:** Routers, switches, and high-speed modems.
* **Embedded Systems:** Industrial PCs and small form-factor controllers.
* **Power Supplies:** Cooling voltage regulators and power MOSFETs.
* **Consumer Electronics:** High-performance TV boxes or gaming peripherals.
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What are the different types of pushPIN attachment options available for this series?
- ⤷ How does the 'C2' thermal interface material compare to other ATS options?
- ⤷ Can this heat sink be used for CPUs or GPUs with higher TDP?