The **ATS-08G-41-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** product line, designed to provide high cooling efficiency in constrained air-flow environments. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-08G-41-C2-R0 | | **Attachment Method** | pushPIN™ (Brass Pins) | | **Material** | Aluminum (Body) / Blue Anodized (Finish) | | **Thermal Resistance** | 10.02°C/W (Unducted Flow @ 100 LFM) | | **Dimensions** | 40mm x 40mm x 25mm | | **Interface Material** | T766 (Thermal Interface Material pre-applied) | --- ### 2. Physical Design Features * **maxiFLOW™ Geometry:** The heat sink features a spread fin pattern. This design increases the surface area while reducing pressure drop, allowing for better cooling even with low-velocity airflow. * **pushPIN™ Attachment:** It utilizes a specialized spring-loaded pin mechanism (brass pins). This ensures consistent pressure on the electronic component (like a CPU or FPGA) to maximize heat transfer through the interface material. * **Material and Finish:** Made from aluminum for lightweight thermal conductivity. The blue anodized finish provides corrosion resistance and increased emissivity. --- ### 3. Thermal Performance (Deg C/W) The performance of the heat sink varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | 100 (0.5 m/s) | 300 (1.5 m/s) | 500 (2.5 m/s) | 700 (3.5 m/s) | | :--- | :--- | :--- | :--- | :--- | | **Thermal Resistance (Unducted)** | 10.02 | 3.65 | 2.36 | 1.81 | | **Thermal Resistance (Ducted)** | 2.00 | 1.45 | 1.23 | 1.10 | --- ### 4. Typical Applications This part is commonly found in electronic assemblies where high-power components generate significant heat in tight spaces: * **Telecommunications:** Cooling of networking chips and switch fabric. * **Embedded Computing:** Cooling high-speed processors or FPGAs. * **Power Supplies:** Heat dissipation for MOSFETs and power regulators. ---