The **ATS-08G-50-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" family, designed for cooling sensitive integrated circuits like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications | Parameter | Specification | Details | | :--- | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | Part of the pushPIN™ series | | **Material** | Aluminum | Lightweight with high thermal conductivity | | **Finish** | Blue Anodized | Increases surface emissivity and prevents corrosion | | **Attachment Method** | Push-Pin | Secure mechanical fastening with springs | | **Pin Material** | Brass | Durable mounting hardware | | **Thermal Interface** | T766 | High-performance thermal grease pre-applied | --- ### 2. Physical Dimensions | Dimension | Value | | :--- | :--- | | **Base Length/Width** | 50mm x 50mm | | **Height** | 15mm | | **Pitch** | 5.90mm | | **Pattern** | 43mm x 43mm (Hole-to-Hole) | --- ### 3. Thermal Performance Thermal resistance determines how effectively the part moves heat away from the electronic component. Performance varies based on the airflow (velocity) within the system: * **Unducted Flow (Low Airflow):** ~9.00 °C/W @ 100 LFM * **Ducted Flow (High Airflow):** ~1.40 °C/W @ 700 LFM --- ### 4. Key Design Features * **Fine Pitch Fin Design:** The heat sink utilizes a specialized fin geometry that maximizes surface area while maintaining a low profile (15mm), making it ideal for space-constrained PCB layouts. * **Push-Pin Mounting:** Unlike adhesive-based heat sinks, the push-pin mechanism provides a consistent "compression force" (calculated via the internal spring), ensuring optimal contact between the heat sink and the chip. * **Pre-applied TIM:** It comes with a **Thermal Interface Material (T766)** already applied to the base, reducing assembly time and ensuring a uniform layer for heat transfer. --- ### 5. Application Examples * **Networking Hardware:** Routers, switches, and bridges. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Electronics:** Voltage regulators and high-speed data converters.