ATS-08G-55-C2-R0
AI

The **ATS-08G-55-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed for cooling integrated circuits (ICs) and high-power electronic components.
### 1. Technical Specifications
This part belongs to the **Advanced Thermal Solutions (ATS)** "Push Pin" series, designed for secure mounting and optimal airflow.
| Attribute | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) |
| **Base Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Brass) |
| **Dimensions** | 40mm x 40mm x 10mm |
| **Thermal Resistance** | 23.98°C/W (at 100 LFM) |
| **Flow Type** | Cross-Cut (Omnidirectional) |
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### 2. Physical Design Features
The construction of this part is engineered for specific thermal and mechanical performance:
* **Fin Style (Cross-Cut):** The fins are cut in both vertical and horizontal directions. This creates "pins" or blocks, allowing air to flow through the heatsink from any direction (omnidirectional). This is ideal for systems where airflow direction is inconsistent.
* **Material:** Made from **6063-T5 aluminum**, which provides a high thermal conductivity to weight ratio.
* **Surface Treatment:** The **Blue Anodized** finish is not just aesthetic; it increases surface emissivity (improving radiation cooling) and provides corrosion resistance.
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### 3. Mounting System
One of the defining features of this specific part number is the **Push-Pin** mounting mechanism:
1. **Spring-Loaded:** The brass push-pins use a compression spring to provide precise downward pressure.
2. **Thermal Interface Material (TIM):** This part typically comes pre-applied with **T766**, a high-performance phase-change material that fills microscopic air gaps between the component and the heatsink.
3. **Stability:** The push-pin design ensures that the heatsink remains in contact with the chip even under mechanical vibration or shock.
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### 4. Thermal Performance Data
Performance varies based on the Airflow (measured in Linear Feet per Minute - LFM):
| Airflow (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| **100** | 23.98 |
| **200** | 10.07 |
| **300** | 6.30 |
| **400** | 4.76 |
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- ⤷
What is the significance of the 'C2' suffix in the ATS part numbering system?
- ⤷ How do I determine if my PCB hole pattern is compatible with this heatsink?
- ⤷ Does this heatsink require a specific type of thermal paste if the pre-applied TIM is removed?