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  • ATS-08G-60-C2-R0

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    The **ATS-08G-60-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the "maxiFLOW™" product line, designed to provide efficient cooling for electronic integrated circuits (ICs). --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Brass pins / Steel springs) | | **Thermal Resistance (Flowing Air)** | 6.36 °C/W @ 100 LFM | | **Dimensions (L x W x H)** | 57.5mm x 40mm x 25mm | | **Weight** | ~48.2 grams | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Electronic & Design Features #### A. maxiFLOW™ Geometry The "G" in the part number refers to the unique fin geometry. Unlike standard square fins, these are tapered and spread out to increase surface area while minimizing pressure drop. This is critical for dense electronic enclosures where airflow may be restricted. #### B. pushPIN™ Attachment System The part uses a specialized mechanical attachment system instead of just adhesive. This ensures: * **Reliable Pressure:** Consistent contact between the heat sink and the chip (e.g., FPGA, GPU). * **Ease of Assembly:** Quick installation via pre-drilled holes in the PCB. * **Shock/Vibration Resistance:** Better durability for industrial or mobile electronics compared to "peel-and-stick" solutions. #### C. Thermal Interface Material (T766) The unit comes with **T766** pre-applied to the base. In electronics, this material fills microscopic air gaps between the heat sink and the semiconductor, significantly improving heat transfer efficiency. --- ### 3. Typical Applications This specific part is sized for large-format semiconductors found in: * **Telecommunications:** High-speed routers and switches. * **Data Centers:** Server CPUs and hardware accelerators. * **Embedded Systems:** Industrial PCs and automation controllers. ---
    ✨ Follow-up Questions
    • ⤷What is the difference between the C2 and C1 versions of this heat sink?
    • ⤷ How do I calculate the correct hole diameter for the pushPIN attachment?
    • ⤷ Can this heat sink be used with custom thermal interface materials?