The **ATS-08G-62-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" family, designed for high-density electronic cooling applications. --- ## 1. Technical Specifications The following table highlights the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 16.48 °C/W (Unducted @ 100 LFM) | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Dimensions (LxWxH)** | 45.00mm x 45.00mm x 15.00mm | | **Fin Style** | Square Neck / Straight Fin | | **TIM (Interface Material)** | T766 (Pre-applied Phase Change Material) | --- ## 2. Component Breakdown ### A. Material and Design * **Aluminum 6063:** This alloy is chosen for its excellent thermal conductivity and structural integrity. * **Straight Fin Design:** This layout is optimized for airflow directed across the fins, providing a high surface area for heat dissipation without significantly restricting air velocity. * **Blue Anodized Coating:** The finish is not merely aesthetic; it protects the aluminum from corrosion and slightly improves heat radiation (emissivity). ### B. Mounting Mechanism (pushPIN™) The part uses a **pushPIN™** system, which consists of a pin and a high-performance compression spring. This setup provides: * **Precise Pressure:** Ensures the heat sink is pressed against the component (like a CPU or FPGA) with consistent force to minimize thermal resistance. * **Ease of Assembly:** Can be installed manually or with basic tools through pre-drilled holes in the PCB. ### C. Thermal Interface Material (TIM) The **T766** material is pre-applied to the base of the heat sink. This is a high-performance thermal pad/grease that fills microscopic air gaps between the electronic component and the heat sink, ensuring maximum heat transfer. --- ## 3. Application Use Cases This specific heat sink is typically used for cooling the following electronic parts: 1. **Processors (CPUs/GPUs):** Low-to-mid power chips in embedded systems. 2. **FPGAs & ASICs:** High-speed logic gates that generate concentrated heat. 3. **Power Modules:** Voltage regulators or power converters requiring a 45mm footprint. ---