The **ATS-08G-64-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to maximize heat dissipation for electronic components like BGAs and CPUs. ### 1. Technical Specifications The following table highlights the core physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Material** | Blue Anodized Aluminum | | **Dimensions** | 45.00mm x 45.00mm | | **Height** | 25.00mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 9.39°C/W (at 200 LFM) | | **Airflow Path** | Slanted Fin Profile (maxiFLOW™) | | **Thermal Interface** | T766 (Pre-applied) | --- ### 2. Key Components & Design Features #### A. The maxiFLOW™ Fin Design The "G" in the part number refers to the unique slanted fin geometry. Unlike traditional straight-fin heat sinks, the maxiFLOW design: * Reduces pressure drop across the component. * Increases surface area for convection. * Allows for better airflow integration in tight PCB environments. #### B. pushPIN™ Attachment Mechanism The **R0** suffix indicates the specific mounting kit. The pushPIN™ system uses a flexible, spring-loaded mechanism that: * Ensures consistent pressure (load) on the electronic chip for optimal heat transfer. * Includes over 20 different spring options for various PCB thicknesses. * Features a "snap-on" installation that requires pre-drilled holes in the PCB. #### C. Thermal Interface Material (TIM) This part comes with **T766** pre-applied to the base. T766 is a high-performance phase-change material that fills microscopic air gaps between the heat sink and the semiconductor, significantly lowering contact resistance. --- ### 3. Common Applications * **Telecommunications:** High-speed routers and switches. * **Data Centers:** Server blades and power modules. * **Embedded Computing:** Industrial PC processors. * **Power Electronics:** IGBT modules or high-output LED drivers. --- ### 4. Part Number Breakdown The nomenclature follows this structure: * **ATS**: Advanced Thermal Solutions. * **08**: Series/Family. * **G**: Fin pattern (maxiFLOW). * **64**: Specific footprint/design ID. * **C2**: Material/Finish code (Blue Anodized). * **R0**: Attachment/Revision code.