ATS-08G-66-C2-R0
AI

The **ATS-08G-66-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure.
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### Technical Specifications
The table below outlines the core physical and thermal characteristics of this part:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin |
| **Fin Type** | Straight Fin (XC-Cut) |
| **Thermal Resistance** | 5.77°C/W (at 100 LFM) |
| **Dimensions (L x W x H)** | 45mm x 45mm x 25mm |
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### Key Electronic Components & Features
#### 1. Push-Pin Attachment Mechanism
The "R0" designation refers to the specific attachment kit. This part uses a **brass push-pin with a steel spring**.
* **Purpose:** It ensures a constant, reliable pressure between the heat sink and the electronic chip (Integrated Circuit).
* **Benefit:** This provides better thermal contact than simple adhesive tapes and allows for secure mounting on the PCB (Printed Circuit Board) through pre-drilled holes.
#### 2. Material and Finish
* **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties.
* **Blue Anodizing:** This is not just for aesthetics; the anodized layer increases surface emissivity, slightly improving heat radiation and providing corrosion resistance for the metal.
#### 3. XC-Cut (Cross-Cut) Fin Design
Unlike a standard extruded heat sink with long straight rails, the ATS-08G-66-C2-R0 features a **cross-cut** design.
* **Function:** This creates a matrix of fins that allows for "omni-directional" airflow.
* **Application:** It is ideal for electronic enclosures where the direction of the cooling fan's airflow might be inconsistent or obstructed.
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### Typical Applications
This specific heat sink is commonly found in the following electronic systems:
* **Networking Equipment:** High-speed routers and switches.
* **Embedded Systems:** Industrial PCs and controllers.
* **Power Supplies:** Cooling voltage regulators or power MOSFETs.
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- ⤷What is the difference between the C1 and C2 versions of this heat sink?
- ⤷ How do I calculate if the 5.77°C/W thermal resistance is sufficient for my chip?
- ⤷ What are the recommended PCB hole sizes for the push-pin mounting?