Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-08G-71-C2-R0

  • AI
    The **ATS-08G-71-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, or high-power ASICs. --- ### 1. Technical Specifications The following table highlights the core physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (with pre-drilled holes) | | **Thermal Resistance** | 6.67°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 20.00mm | | **Fin Style** | Straight Fin | | **Interface Material** | T766 (High Performance Thermal Tape) | --- ### 2. Key Components & Design Features #### A. Thermal Interface Material (TIM) The part comes with **T766** pre-applied. This is a phase-change material or high-performance tape that fills microscopic air gaps between the heat source and the aluminum base, significantly reducing thermal resistance. #### B. Push Pin Attachment Instead of using messy adhesives or expensive screws, this model utilizes a **Plastic Push Pin** system with a spring. * **Benefits:** Provides consistent pressure for optimal thermal contact and allows for easy removal/rework without damaging the PCB. * **Hardware:** Typically involves a 4.7mm or 3mm hole in the PCB. #### C. Straight Fin Geometry The "G" in the part number signifies a straight-fin design. This is optimized for **forced air convection** (where a fan is present). The vertical fins provide a large surface area for heat dissipation into the moving air stream. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying variants: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **08** | Series Identifier (Push Pin Attachment) | | **G** | Straight Fin Profile | | **71** | Specific dimension/fin count code | | **C2** | Thermal Performance/Material Grade | | **R0** | Revision code (RoHS Compliant) | --- ### 4. Application Use Cases This heat sink is typically found in: * **Networking Equipment:** Routers, switches, and firewalls. * **Industrial PCs:** Cooling embedded processors. * **Power Supplies:** Heat dissipation for MOSFETs and Voltage Regulators.
    ✨ Follow-up Questions
    • ⤷ What are the specific PCB hole requirements for the push-pin mounting?
    • ⤷ How does the thermal resistance change at higher airflows (e.g.
    • ⤷ 500 LFM)?
    • ⤷ Is this heat sink compatible with standard 45mm x 45mm BGA packages?