The **ATS-08G-91-C3-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Push-Pin Heat Sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary technical parameters for this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 22.07°C/W (Unducted) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Interface Material** | T412 (Pre-applied) | --- ### 2. Physical Dimensions The physical footprint is critical for PCB layout and clearance planning: * **Size (L x W):** 40.00mm x 40.00mm * **Height:** 10.00mm * **Fin Pitch:** Fine Pitch * **Fin Pattern:** Straight Fin --- ### 3. Key Electronic Components & Features #### A. The Heat Sink Body The body is made of **AL6063 aluminum**, chosen for its high thermal conductivity and lightweight properties. The "Straight Fin" design allows for maximum airflow surface area, which is vital for forced convection cooling. #### B. The Push-Pin Fastener This model uses a **spring-loaded push-pin** mechanism. * **Function:** It ensures a constant, high-pressure contact between the heat sink and the electronic chip. * **Benefit:** This prevents air gaps and compensates for mechanical vibrations that might occur in industrial or automotive environments. #### C. Thermal Interface Material (TIM) The part comes with **T412** pre-applied to the base. * **Function:** T412 is a phase-change material or high-performance thermal pad that fills microscopic air gaps between the chip and the heat sink. * **Electronic Importance:** It reduces the contact resistance, ensuring that heat moves efficiently from the silicon die into the aluminum fins. #### D. Blue Anodized Finish The blue coating is not just aesthetic; it provides **corrosion resistance** and minor electrical insulation. It also slightly improves "emissivity," which helps with radiant heat transfer. --- ### 4. Application Use-Case This part is typically found in: 1. **Network Switches:** Cooling the primary processing chips. 2. **Embedded Systems:** On industrial motherboards where vertical space (10mm height) is limited. 3. **Power Supplies:** Cooling voltage regulators or MOSFETs. ---