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  • ATS-08G-92-C2-R0

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    The **ATS-08G-92-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed by Advanced Thermal Solutions (ATS) for cooling integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics. Here is a breakdown of its core specifications: | Feature | Specification | | :--- | :--- | | **Product Type** | Push-Pin Heatsink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 40mm x 40mm x 15mm | | **Attachment Method** | Push-Pin (Plastic) with Brass Springs | | **Thermal Resistance** | 16.48°C/W (at 100 LFM) | | **Fin Style** | Straight Fin (High density) | | **Thermal Interface** | T766 (Pre-applied thermal tape/pad) | --- ### 2. Key Electronic Functions While the heatsink itself is a passive mechanical part, its role in an electronic system is critical for reliability: * **Heat Dissipation:** It increases the surface area of a heat-generating component (like a CPU, FPGA, or MOSFET), allowing the ambient air to carry heat away more efficiently. * **Thermal Protection:** By maintaining the junction temperature ($T_j$) of a semiconductor below its maximum rating, it prevents thermal throttling and permanent hardware failure. * **Mechanical Stability:** The "Push-Pin" design ensures consistent pressure across the surface of the electronic chip, which optimizes the contact with the Thermal Interface Material (TIM). --- ### 3. Application Use Cases This specific model is commonly used in environments where space is limited but high airflow is present: 1. **Telecommunications:** Cooling chips on line cards or routers. 2. **Embedded Systems:** Industrial PCs where high-performance processors are used in compact enclosures. 3. **Power Supplies:** Managing the heat of high-speed switching regulators. --- ### 4. Thermal Performance Data Performance varies based on the airflow velocity (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 16.48 | | 200 (1.0 m/s) | 6.17 | | 400 (2.0 m/s) | 3.46 | | 600 (3.0 m/s) | 2.55 | ---
    ✨ Follow-up Questions
    • ⤷ What is the difference between push-pin and adhesive mounting for this heatsink?
    • ⤷ How does the 'Blue Anodized' finish affect thermal performance compared to bare aluminum?
    • ⤷ Can this heatsink be used on a chip smaller than 40mm x 40mm?