ATS-08G-92-C2-R0
AI

The **ATS-08G-92-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed by Advanced Thermal Solutions (ATS) for cooling integrated circuits (ICs) and other electronic components.
---
### 1. Technical Specifications
The part number encodes specific physical and thermal characteristics. Here is a breakdown of its core specifications:
| Feature | Specification |
| :--- | :--- |
| **Product Type** | Push-Pin Heatsink |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions** | 40mm x 40mm x 15mm |
| **Attachment Method** | Push-Pin (Plastic) with Brass Springs |
| **Thermal Resistance** | 16.48°C/W (at 100 LFM) |
| **Fin Style** | Straight Fin (High density) |
| **Thermal Interface** | T766 (Pre-applied thermal tape/pad) |
---
### 2. Key Electronic Functions
While the heatsink itself is a passive mechanical part, its role in an electronic system is critical for reliability:
* **Heat Dissipation:** It increases the surface area of a heat-generating component (like a CPU, FPGA, or MOSFET), allowing the ambient air to carry heat away more efficiently.
* **Thermal Protection:** By maintaining the junction temperature ($T_j$) of a semiconductor below its maximum rating, it prevents thermal throttling and permanent hardware failure.
* **Mechanical Stability:** The "Push-Pin" design ensures consistent pressure across the surface of the electronic chip, which optimizes the contact with the Thermal Interface Material (TIM).
---
### 3. Application Use Cases
This specific model is commonly used in environments where space is limited but high airflow is present:
1. **Telecommunications:** Cooling chips on line cards or routers.
2. **Embedded Systems:** Industrial PCs where high-performance processors are used in compact enclosures.
3. **Power Supplies:** Managing the heat of high-speed switching regulators.
---
### 4. Thermal Performance Data
Performance varies based on the airflow velocity (measured in Linear Feet per Minute - LFM):
| Air Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 16.48 |
| 200 (1.0 m/s) | 6.17 |
| 400 (2.0 m/s) | 3.46 |
| 600 (3.0 m/s) | 2.55 |
---
- ⤷
What is the difference between push-pin and adhesive mounting for this heatsink?
- ⤷ How does the 'Blue Anodized' finish affect thermal performance compared to bare aluminum?
- ⤷ Can this heatsink be used on a chip smaller than 40mm x 40mm?