The **ATS-08H-07-C2-R0** is a specific model of high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push-pin" series designed for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) with Spring | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 12.70mm | | **Thermal Resistance** | 17.03°C/W (at 100 LFM) | | **Airflow Pattern** | Straight Fin | | **Thermal Interface (TIM)** | T766 (Pre-applied) | --- ### 2. Key Design Features #### A. Attachment Mechanism (Push-Pin) The "R0" suffix indicates the use of **plastic push-pins** and springs. This mechanism provides: * **Consistent Pressure:** The springs ensure a specific amount of force is applied to the component, improving thermal contact. * **Ease of Assembly:** No special tools are required for installation on a PCB with pre-drilled holes. #### B. Material and Finish * **Aluminum:** Chosen for its lightweight properties and cost-effective thermal conductivity. * **Blue Anodized:** The anodization layer provides corrosion resistance and slightly improves emissivity (heat radiation) compared to bare aluminum. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This is a phase-change material or high-performance thermal pad that fills microscopic air gaps between the heat sink and the electronic chip to maximize heat transfer. --- ### 3. Application Use Cases This heat sink is typically used for: 1. **BGA Cooling:** Ball Grid Array components found in networking gear. 2. **FPGA/ASIC:** High-speed processors that generate significant localized heat. 3. **Power Supplies:** Cooling voltage regulators or power MOSFETs. --- ### 4. Thermal Performance Comparison Thermal resistance decreases as airflow increases. Note the performance variance based on Linear Feet per Minute (LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural Convection) | 17.03 | | 300 (Moderate Airflow) | 5.38 | | 500 (High Airflow) | 3.64 |