The **ATS-08H-100-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the physical and thermal characteristics of the device. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Fin Style** | Straight (Cross-Cut) | | **Attachment Method** | Push-Pin | | **Thermal Resistance** | 4.84°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **Finish** | Blue Anodized | --- ### 2. Key Electronic Features #### A. Thermal Interface Material (TIM) This specific model usually comes with **T766** pre-applied thermal interface material. In electronics, the TIM is crucial because it fills microscopic air gaps between the heat source (the silicon die) and the heat sink, ensuring maximum heat transfer efficiency. #### B. pushPIN™ Attachment Unlike adhesive tapes that can degrade over time or screws that might over-tighten, the pushPIN™ system uses a **flexible spring mechanism**. * **Safety:** Ensures consistent pressure across the component. * **Compatibility:** Designed for pre-drilled holes in PCBs (Printed Circuit Boards). #### C. Fin Design & Airflow The "08H" designation refers to the fin density and pattern. * **High Surface Area:** The straight-fin design is optimized for both natural convection and forced-air (fan-driven) environments. * **Blue Anodized Finish:** While aesthetic, the anodization also provides a layer of electrical insulation and protects the aluminum from corrosion. --- ### 3. Application Use Cases This part is commonly found in industrial and consumer electronics where space is limited but heat generation is high: 1. **Network Switches/Routers:** Cooling high-speed processing chips. 2. **Embedded Systems:** For single-board computers that operate in enclosed environments. 3. **Power Supplies:** Cooling voltage regulators or MOSFETs. --- ### 4. Thermal Performance Comparison Thermal resistance is measured in °C/W (Degrees Celsius per Watt). A lower number indicates better cooling. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural/Low) | 4.84 | | 300 (Moderate) | 1.87 | | 500 (High) | 1.31 |