The **ATS-08H-142-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **push-pin** attachment series and is specifically designed for cooling electronic components such as CPUs, GPUs, or high-power semiconductors. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Fin Style** | Straight (High-density) | | **Thermal Resistance** | 4.85°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 30mm x 30mm x 15mm | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Design Elements #### A. The Heat Sink Body The part is made from aluminum for efficient heat conduction. The **Blue Anodized** finish is not just for aesthetics; it provides surface protection and slightly improves radiative heat transfer. The "142" series features a specific fin height (15mm) designed for low-profile airflow environments. #### B. Push-Pin Attachment System Unlike adhesive-based heat sinks, this model uses a mechanical **push-pin and spring** system. * **Reliability:** Provides consistent pressure on the component, improving thermal contact. * **Ease of Assembly:** Features a "snap-in" installation into pre-drilled holes on the PCB. * **Spring Type:** Usually utilizes a stainless steel or brass spring to maintain tension over time. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This is a Phase Change Material (PCM) that fills microscopic air gaps between the chip and the heat sink, significantly lowering thermal impedance. --- ### 3. Thermal Performance Analysis The efficiency of the ATS-08H-142-C2-R0 is highly dependent on the velocity of the air (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (1.0 m/s)** | 4.85 | | **400 (2.0 m/s)** | 2.50 | | **600 (3.0 m/s)** | 1.95 | --- ### 4. Typical Applications * **Embedded Systems:** Cooling microprocessors in industrial PCs. * **Networking Hardware:** Dissipating heat from high-speed ASICs in routers or switches. * **Power Supplies:** Managing thermals for MOSFETs or voltage regulators.