ATS-08H-152-C2-R0
AI

The part number **ATS-08H-152-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "maxiFLOW™" series, designed specifically for cooling electronic components like CPUs, GPUs, and other integrated circuits.
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### 1. Technical Specifications
The following table outlines the key physical and thermal characteristics of this component:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum (Blue Anodized) |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 3.32°C/W (at 200 LFM) |
| **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 25.00mm |
| **Fin Style** | Straight (maxiFLOW™) |
| **Thermal Interface Material** | T766 (Pre-applied) |
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### 2. Design and Engineering Features
* **maxiFLOW™ Geometry:** The fin structure is designed to maximize surface area while maintaining low pressure drop. This allows for efficient heat dissipation in air-cooled environments.
* **pushPIN™ Attachment:** This system uses a flexible, spring-loaded mechanism to ensure consistent pressure between the heat sink and the electronic component, which improves thermal transfer and prevents damage during vibration or shipping.
* **Blue Anodized Finish:** Beyond aesthetics, the anodized coating provides corrosion resistance and improves thermal radiation.
* **Phase-Change Material:** The "T766" thermal interface material (TIM) is pre-applied to the base, ensuring there are no air gaps between the component and the heat sink.
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### 3. Application Use Cases
This specific heat sink is typically found in:
1. **Networking Hardware:** Routers, switches, and high-speed modems.
2. **Embedded Computing:** Industrial PC boards and single-board computers (SBCs).
3. **Power Supplies:** Cooling voltage regulators and power MOSFETs.
4. **LED Drivers:** Managing heat in high-output lighting systems.
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### 4. Part Number Breakdown
* **ATS:** Manufacturer (Advanced Thermal Solutions)
* **08:** Series/Fin configuration code
* **H:** Attachment type (pushPIN™)
* **152:** Dimensional code (35x35mm)
* **C2:** Material/Finish (Blue Anodized Aluminum)
* **R0:** Revision/Packaging status
- ⤷What is the difference between thermal resistance at 200 LFM versus 800 LFM for this model?
- ⤷ Can the pushPIN attachment be used on any standard PCB layout?
- ⤷ How does the T766 thermal material compare to standard thermal grease?