The **ATS-08H-153-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series, designed for effective thermal management of electronic components such as CPUs, GPUs, and other integrated circuits. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 4.05°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 10.00mm | | **Fin Pattern** | Square-Cut | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Design Breakdown #### A. The Fin Design (Square-Cut) The heat sink features a **square-cut fin pattern**, which allows for multi-directional airflow. This is particularly useful in electronic enclosures where the direction of the air coming from cooling fans might not be perfectly linear. #### B. Material and Coating - **Aluminum:** Provides a lightweight solution with excellent thermal conductivity. - **Blue Anodized Finish:** This is not just for aesthetics; anodizing increases the surface emissivity (helping with radiation heat transfer) and provides a protective layer against corrosion and electrical conductivity on the surface. #### C. pushPIN™ Attachment System This part uses a specific mounting mechanism that includes: - **Brass components:** For durability. - **Compression Springs:** These provide precise, consistent pressure (force) against the electronic component to ensure maximum thermal transfer. - **Plastic push-pins:** Designed for quick and secure installation into pre-drilled holes on a PCB. --- ### 3. Performance Metrics The effectiveness of this part is measured by its **Thermal Resistance**. Lower values indicate better cooling performance. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 4.05 | | 300 (1.5 m/s) | 2.59 | | 500 (2.5 m/s) | 2.15 | --- ### 4. Implementation Considerations * **Space:** With a height of only 10mm, it is considered a low-profile heat sink, making it ideal for compact servers or slim electronic devices. * **TIM:** Since it comes with **T766 thermal grease** pre-applied, it simplifies the assembly process on the production line, ensuring a standardized layer of interface material between the chip and the heat sink.