The **ATS-08H-19-C2-R0** is a specific electronic component categorized as a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from surface-mount devices (SMDs) like processors, FPGAs, or power regulators to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The model number encodes several physical and thermal characteristics. Here are the key specifications: | Feature | Specification | | :--- | :--- | | **Component Type** | Passive Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Thermal Resistance (Flowing Air)** | 9.77°C/W @ 100 LFM | | **Thermal Resistance (Static Air)** | 1.83°C/W @ 700 LFM | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 20.00mm | --- ### 2. Key Design Features #### A. Fin Geometry (Cross-Cut) This model features a **cross-cut** fin design. Unlike straight fins that require airflow from a specific direction, cross-cut fins allow for multi-directional airflow. This makes it highly efficient in crowded PCB environments where air currents may be turbulent. #### B. pushPIN™ Attachment The "R0" at the end of the part number indicates the attachment system. It uses the **pushPIN™** mechanism, which offers: * **Uniform Pressure:** Ensures a consistent interface between the heat sink and the component for better thermal transfer. * **Security:** High-performance springs and plastic/brass pins prevent the heat sink from shifting during vibration or shipping. #### C. Thermal Interface Material (TIM) Typically, these units come pre-applied with **T766** phase-change material or similar high-performance thermal grease. This eliminates the need for manual application and reduces assembly time. --- ### 3. Application Use-Cases The ATS-08H-19-C2-R0 is commonly used in the following electronic sectors: 1. **Telecommunications:** Cooling high-speed switching equipment. 2. **Embedded Systems:** For industrial PCs where space is limited but heat generation is high. 3. **Power Supplies:** Dissipating heat from large MOSFETs or voltage regulators. --- ### 4. Thermal Performance Comparison Below is a simplified view of how air velocity affects its performance: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 9.77 | | 300 (1.5 m/s) | 3.22 | | 500 (2.5 m/s) | 2.21 | | 700 (3.5 m/s) | 1.83 |