ATS-08H-196-C2-R0
AI

The **ATS-08H-196-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) like CPUs, GPUs, or power transistors.
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### 1. Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal characteristics:
| Property | Description |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ HS Assembly |
| **Heat Sink Type** | Fine Pitch (Cross-Cut) |
| **Material** | Aluminum (Blue Anodized) |
| **Attachment Method** | Push-Pin (Brass) |
| **Thermal Resistance** | 18.11°C/W (Unducted) |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### 2. Physical Dimensions
Precision measurements are critical for PCB clearance and component fit:
* **Length (Dimension A):** 45.00 mm
* **Width (Dimension B):** 45.00 mm
* **Height (Dimension C):** 10.00 mm (Low profile)
* **Pitch (Dimension E):** 38.00 mm (Distance between attachment pins)
* **Pitch (Dimension F):** 38.00 mm
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### 3. Key Electronic/Thermal Features
* **Fine-Pitch Fin Design:** The "Cross-Cut" pattern provides a high surface area to volume ratio, which is optimized for systems with consistent airflow.
* **Push-Pin Attachment:** It uses a spring-loaded brass push-pin mechanism. This provides high mounting pressure to improve the contact between the heat sink base and the electronic component, reducing thermal resistance.
* **Low Profile:** At only 10mm high, it is suitable for 1U servers or compact electronic enclosures where vertical space is limited.
* **T766 Thermal Interface:** This is a high-performance thermal grease pre-applied to the bottom surface, ensuring immediate installation without needing separate paste.
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### 4. Application Use Cases
1. **Telecommunications:** Used on high-speed networking chips.
2. **Power Supplies:** Cooling MOSFETs or voltage regulators.
3. **Embedded Systems:** Ideal for ARM processors or FPGAs in industrial controllers.
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- ⤷
What is the maximum airflow (LFM) recommended for this heat sink?
- ⤷ Can the push-pin hardware be replaced with screws for high-vibration environments?
- ⤷ How does the T766 thermal material compare to standard silicone-based pastes?