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  • ATS-08H-196-C2-R0

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    The **ATS-08H-196-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) like CPUs, GPUs, or power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Property | Description | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ HS Assembly | | **Heat Sink Type** | Fine Pitch (Cross-Cut) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 18.11°C/W (Unducted) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Physical Dimensions Precision measurements are critical for PCB clearance and component fit: * **Length (Dimension A):** 45.00 mm * **Width (Dimension B):** 45.00 mm * **Height (Dimension C):** 10.00 mm (Low profile) * **Pitch (Dimension E):** 38.00 mm (Distance between attachment pins) * **Pitch (Dimension F):** 38.00 mm --- ### 3. Key Electronic/Thermal Features * **Fine-Pitch Fin Design:** The "Cross-Cut" pattern provides a high surface area to volume ratio, which is optimized for systems with consistent airflow. * **Push-Pin Attachment:** It uses a spring-loaded brass push-pin mechanism. This provides high mounting pressure to improve the contact between the heat sink base and the electronic component, reducing thermal resistance. * **Low Profile:** At only 10mm high, it is suitable for 1U servers or compact electronic enclosures where vertical space is limited. * **T766 Thermal Interface:** This is a high-performance thermal grease pre-applied to the bottom surface, ensuring immediate installation without needing separate paste. --- ### 4. Application Use Cases 1. **Telecommunications:** Used on high-speed networking chips. 2. **Power Supplies:** Cooling MOSFETs or voltage regulators. 3. **Embedded Systems:** Ideal for ARM processors or FPGAs in industrial controllers. ---
    ✨ Follow-up Questions
    • ⤷ What is the maximum airflow (LFM) recommended for this heat sink?
    • ⤷ Can the push-pin hardware be replaced with screws for high-vibration environments?
    • ⤷ How does the T766 thermal material compare to standard silicone-based pastes?