The **ATS-08H-23-C2-R0** is a specific model of a **High-Performance Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or damage. --- ### 1. Technical Specifications The part number itself contains specific data about its dimensions and thermal properties: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W x H)** | 60mm x 60mm x 15mm | | **Thermal Resistance** | 12.00 °C/W (at 200 LFM) | | **Fin Style** | Straight | | **Series** | pushPIN™ | --- ### 2. Component Breakdown #### A. The Heat Sink Body * **Material:** Made of high-grade aluminum, which offers a balance between thermal conductivity and weight. * **Fin Geometry:** It features a "straight-fin" design. This is optimized for airflow in a single direction (unidirectional), making it ideal for systems with clear intake-to-exhaust paths. * **Anodization:** The "C2" in the part number indicates a **Blue Anodized** finish. This layer protects the aluminum from corrosion and slightly increases surface emissivity for better radiation. #### B. The Mounting System (pushPIN™) The "R0" designation refers to the mounting kit: * **Push-Pins:** It uses flexible plastic or brass push-pins that click into pre-drilled holes on a PCB (Printed Circuit Board). * **Compression Springs:** Each pin includes a high-performance spring that provides precise "Firm Pressure" (approximately 20psi) to ensure optimal contact between the heat sink and the electronic chip. --- ### 3. Thermal Performance Context The performance of this part is measured by its **Thermal Resistance**. In electronics, a lower number is better: * **At Still Air:** The resistance is highest (~12.01 °C/W), meaning it is not very effective without a fan. * **At 200 LFM (Linear Feet per Minute):** The resistance drops significantly, allowing the component to run much cooler under active airflow. --- ### 4. Applications This electronic part is commonly found in: 1. **Telecommunications:** High-speed routers and switches. 2. **Industrial PCs:** Compact motherboards where vertical space is limited (15mm height). 3. **Power Electronics:** Cooling MOSFETs or voltage regulators.