The **ATS-08H-25-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heatsink**. It is designed to dissipate heat from surface-mount components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary mechanical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Dimension (L x W x H)** | 60mm x 60mm x 25mm | | **Fin Style** | XC-Cut (Cross-cut) | | **Thermal Resistance** | 6.26°C/W (at 200 LFM) | | **Thermal Interface Material** | T766 (Pre-applied Phase Change Material) | --- ### 2. Design Features The "electronic" functionality of this part is centered around passive cooling efficiency. * **XC-Cut Fin Pattern:** The fins are not continuous strips; they are cut in a grid pattern. This allows for multi-directional airflow, making it ideal for systems where the air direction might change or is turbulent. * **Push-Pin Mounting:** This mechanical system uses a spring-loaded pin to provide consistent downward pressure on the electronic chip. This ensures the **Thermal Interface Material (TIM)** stays in constant contact, preventing air gaps that cause overheating. * **T766 Thermal Material:** The base comes pre-coated with a high-performance phase-change material. When the chip heats up, the material softens to fill microscopic imperfections between the chip and the heatsink. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying the exact variant: * **ATS:** Manufacturer (Advanced Thermal Solutions) * **08:** Heat sink series * **H:** High performance * **25:** Height (25mm) * **C2:** Material/Color (Blue Anodized Aluminum) * **R0:** Revision/Packaging code --- ### 4. Application Use-Case This part is typically used in industrial or networking hardware where: 1. **High Heat Flux:** The chip generates significant heat but is in a space-constrained environment. 2. **Reliability:** Mechanical push-pins are preferred over adhesive tapes for high-vibration environments (like aerospace or automotive). 3. **Efficiency:** It is designed for "Forced Air" environments (where a fan is present), as indicated by its specific thermal resistance curves at various LFM (Linear Feet per Minute) ratings.