The **ATS-08H-33-C2-R0** is a high-performance electronic thermal management component, specifically an **Aluminum Pin Fin Heat Sink** manufactured by Advanced Thermal Solutions, Inc. (ATS). ### 1. Technical Specifications This part is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-08H-33-C2-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Footprint (Size)** | 36.83mm x 36.83mm | | **Height** | 17.78mm | | **Thermal Resistance** | 17.42°C/W (Unducted Flow @ 1.0 m/s) | | **Weight** | ~40-50 grams | --- ### 2. Design Characteristics #### A. Pin Fin Geometry Unlike traditional straight-fin heat sinks, the "Pin Fin" design consists of a grid of vertical pins. * **Omnidirectional Airflow:** This allows air to enter and exit from any direction, making it ideal for systems where the airflow direction is unpredictable or obstructed. * **Surface Area:** The pin density maximizes the surface area available for convective cooling. #### B. pushPIN™ Attachment System The "08H" series features the proprietary **pushPIN™** system, which includes: * **Pre-assembled Springs:** Provides a specific "Firmness" or pressure to ensure high thermal interface contact. * **Compression Springs:** These prevent the heat sink from shifting during mechanical shock or vibration. * **Compatibility:** Designed for easy installation into pre-drilled holes on a PCB (Printed Circuit Board). #### C. Thermal Interface Material (TIM) The "C2" suffix typically denotes that the part comes with **T766** phase-change material or a high-performance thermal pad pre-applied to the base. This ensures there are no air gaps between the heat sink and the electronic chip. --- ### 3. Thermal Performance Comparison Thermal resistance ($R_{th}$) determines how efficiently heat moves from the component to the air. Lower numbers indicate better cooling. | Air Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | | 1.0 (LFM 200) | 17.42 | | 2.0 (LFM 400) | 7.67 | | 3.0 (LFM 600) | 5.34 | --- ### 4. Typical Applications * **Telecommunications:** Cooling of high-speed networking processors. * **Embedded Systems:** Industrial PCs where space is limited but heat generation is high. * **Power Supplies:** Heat dissipation for MOSFETs and Voltage Regulators.