The **ATS-08H-35-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). ### 1. Technical Specifications This part is designed for cooling electronic components like CPUs, GPUs, or high-power semiconductors. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Base Series** | pushPIN™ HS | | **Attachment Type** | Push-Pin (Spring-loaded) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 22.48°C/W (Unducted Flow @ 100 LFM) | | **Dimensions** | 35.00mm x 35.00mm | | **Height (Off Base)** | 10.00mm | --- ### 2. Key Component Features #### A. Fine-Pitch Design The "H" in the part number often refers to the fin pitch/density. This model uses a **Fine-Pitch** pattern, which provides a larger surface area to dissipate heat effectively in high-airflow environments. #### B. pushPIN™ Attachment Unlike adhesive tapes or simple clips, this part uses a mechanical push-pin system: * **Stability:** Ensures consistent pressure between the heat sink and the component. * **TIM:** It usually comes with a pre-applied **Thermal Interface Material (T766)**, which is a phase-change material that improves heat transfer across the microscopic gaps between the chip and the metal. #### C. Material and Coating * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodize:** This is not just for aesthetics; the anodized layer provides corrosion resistance and improves the emissivity of the surface for better radiation cooling. --- ### 3. Thermal Performance Metrics The effectiveness of this heat sink depends on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 22.48 | | 300 (1.5 m/s) | 6.62 | | 500 (2.5 m/s) | 4.18 | --- ### 4. Common Applications * **Networking Hardware:** Routers, switches, and modems. * **Embedded Systems:** Industrial PCs and IoT gateways. * **Power Supplies:** Cooling MOSFETs or voltage regulators.