Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-08H-36-C2-R0

  • AI
    The **ATS-08H-36-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits that generate significant heat during operation. --- ### 1. Technical Specifications The following table highlights the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Anodized Blue) | | **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 12.7mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 14.82 °C/W (at 100 LFM) | | **Fin Style** | Fine Pitch (Straight Fin) | | **Weight** | ~11 grams | --- ### 2. Key Features and Design This heat sink belongs to the **pushPIN™** series, which focuses on secure and efficient attachment to a Printed Circuit Board (PCB). * **Heat Dissipation Design:** The straight-fin design is optimized for environments with consistent airflow. The fine pitch allows for a high surface area to volume ratio, maximizing cooling efficiency in compact spaces. * **Attachment Mechanism:** It utilizes a **brass/plastic pushpin** system with a compression spring. This ensures even pressure across the thermal interface material (TIM), preventing damage to the chip while maintaining high thermal conductivity. * **Material Finish:** The blue anodized finish is not just aesthetic; it provides surface protection against corrosion and increases thermal emissivity slightly. --- ### 3. Application Use Cases The ATS-08H-36-C2-R0 is commonly used in the following electronic sectors: 1. **Telecommunications:** Cooling of high-speed network switches and routers. 2. **Embedded Systems:** Industrial PCs and automation controllers where space is limited. 3. **Power Electronics:** Cooling for Voltage Regulators (VRMs) and power MOSFETs. 4. **Computing:** Chipset cooling on motherboards or expansion cards. --- ### 4. Selection Criteria (C2-R0 Suffix) The suffix provides specific details about the configuration: * **C2:** Indicates the use of a **Blue Anodized** finish and specific thermal interface material (usually a high-performance phase-change material or pre-applied grease). * **R0:** Refers to the revision code and packaging/mounting hardware configuration. ---
    ✨ Follow-up Questions
    • ⤷What is the difference between pushPIN and adhesive mounting for heat sinks?
    • ⤷ How do I calculate the airflow requirements for this specific model?
    • ⤷ Are there copper alternatives to the ATS-08H-36 series for better thermal conductivity?