ATS-08H-36-C2-R0
AI

The **ATS-08H-36-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits that generate significant heat during operation.
---
### 1. Technical Specifications
The following table highlights the physical and thermal properties of the component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (Anodized Blue) |
| **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 12.7mm |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 14.82 °C/W (at 100 LFM) |
| **Fin Style** | Fine Pitch (Straight Fin) |
| **Weight** | ~11 grams |
---
### 2. Key Features and Design
This heat sink belongs to the **pushPIN™** series, which focuses on secure and efficient attachment to a Printed Circuit Board (PCB).
* **Heat Dissipation Design:** The straight-fin design is optimized for environments with consistent airflow. The fine pitch allows for a high surface area to volume ratio, maximizing cooling efficiency in compact spaces.
* **Attachment Mechanism:** It utilizes a **brass/plastic pushpin** system with a compression spring. This ensures even pressure across the thermal interface material (TIM), preventing damage to the chip while maintaining high thermal conductivity.
* **Material Finish:** The blue anodized finish is not just aesthetic; it provides surface protection against corrosion and increases thermal emissivity slightly.
---
### 3. Application Use Cases
The ATS-08H-36-C2-R0 is commonly used in the following electronic sectors:
1. **Telecommunications:** Cooling of high-speed network switches and routers.
2. **Embedded Systems:** Industrial PCs and automation controllers where space is limited.
3. **Power Electronics:** Cooling for Voltage Regulators (VRMs) and power MOSFETs.
4. **Computing:** Chipset cooling on motherboards or expansion cards.
---
### 4. Selection Criteria (C2-R0 Suffix)
The suffix provides specific details about the configuration:
* **C2:** Indicates the use of a **Blue Anodized** finish and specific thermal interface material (usually a high-performance phase-change material or pre-applied grease).
* **R0:** Refers to the revision code and packaging/mounting hardware configuration.
---
- ⤷What is the difference between pushPIN and adhesive mounting for heat sinks?
- ⤷ How do I calculate the airflow requirements for this specific model?
- ⤷ Are there copper alternatives to the ATS-08H-36 series for better thermal conductivity?