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  • ATS-08H-39-C2-R0

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    The **ATS-08H-39-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### Technical Specifications The table below outlines the core physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Dimension (L x W x H)** | 54.00mm x 40.00mm x 12.70mm | | **Thermal Resistance** | 18.94° C/W (@ 100 LFM) | | **Flow Pattern** | Straight Fin | --- ### Key Design Features 1. **Straight Fin Geometry:** The "Straight Fin" design is optimized for environments with consistent airflow. It allows air to pass through the fins with minimal pressure drop, making it ideal for high-velocity air cooling. 2. **pushPIN™ Attachment:** This part utilizes a standardized push-pin mounting system. This provides: * **Consistent Pressure:** Ensures the thermal interface material (TIM) is compressed evenly against the component. * **Ease of Assembly:** Quick installation into pre-drilled holes on a PCB without the need for complex tools. 3. **Blue Anodized Finish:** Beyond aesthetics, the anodized coating increases the surface area at a microscopic level and protects the aluminum from corrosion. 4. **Material (AL6063):** Aluminum is used because it offers an excellent balance between high thermal conductivity, lightweight properties, and cost-effectiveness. --- ### Thermal Performance Overview Thermal resistance is measured in °C/W (Degrees Celsius per Watt). As airflow increases (measured in Linear Feet per Minute - LFM), the resistance drops, meaning the heat sink becomes more efficient. | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 18.94 | | 200 | 1.0 | 13.68 | | 400 | 2.0 | 9.01 | | 600 | 3.0 | 7.03 | --- ### Typical Applications * **Embedded Systems:** Industrial PCs and controllers. * **Telecommunications:** Network switches and routers. * **Power Supplies:** Heat dissipation for MOSFETs and Voltage Regulators.
    ✨ Follow-up Questions
    • ⤷ What are the compatible hole patterns for the push-pin mounting on this model?
    • ⤷ How does 'Blue Anodized' finishing impact thermal radiation compared to bare aluminum?
    • ⤷ Can this heat sink be used with forced air cooling only
    • ⤷ or is it suitable for natural convection?