ATS-08H-39-C2-R0
AI

The **ATS-08H-39-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure.
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### Technical Specifications
The table below outlines the core physical and thermal characteristics of the part:
| Characteristic | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. |
| **Series** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic/Brass) |
| **Dimension (L x W x H)** | 54.00mm x 40.00mm x 12.70mm |
| **Thermal Resistance** | 18.94° C/W (@ 100 LFM) |
| **Flow Pattern** | Straight Fin |
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### Key Design Features
1. **Straight Fin Geometry:**
The "Straight Fin" design is optimized for environments with consistent airflow. It allows air to pass through the fins with minimal pressure drop, making it ideal for high-velocity air cooling.
2. **pushPIN™ Attachment:**
This part utilizes a standardized push-pin mounting system. This provides:
* **Consistent Pressure:** Ensures the thermal interface material (TIM) is compressed evenly against the component.
* **Ease of Assembly:** Quick installation into pre-drilled holes on a PCB without the need for complex tools.
3. **Blue Anodized Finish:**
Beyond aesthetics, the anodized coating increases the surface area at a microscopic level and protects the aluminum from corrosion.
4. **Material (AL6063):**
Aluminum is used because it offers an excellent balance between high thermal conductivity, lightweight properties, and cost-effectiveness.
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### Thermal Performance Overview
Thermal resistance is measured in °C/W (Degrees Celsius per Watt). As airflow increases (measured in Linear Feet per Minute - LFM), the resistance drops, meaning the heat sink becomes more efficient.
| Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) |
| :--- | :--- | :--- |
| 100 | 0.5 | 18.94 |
| 200 | 1.0 | 13.68 |
| 400 | 2.0 | 9.01 |
| 600 | 3.0 | 7.03 |
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### Typical Applications
* **Embedded Systems:** Industrial PCs and controllers.
* **Telecommunications:** Network switches and routers.
* **Power Supplies:** Heat dissipation for MOSFETs and Voltage Regulators.
- ⤷
What are the compatible hole patterns for the push-pin mounting on this model?
- ⤷ How does 'Blue Anodized' finishing impact thermal radiation compared to bare aluminum?
- ⤷ Can this heat sink be used with forced air cooling only
- ⤷ or is it suitable for natural convection?