The **ATS-08H-40-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the "push-pin" series designed for securing the cooling element to a PCB. ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific model: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 57.90mm x 60.96mm x 15.24mm | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | | **Flow Direction** | XC (Cross-Cut) / Omni-directional | --- ### 2. Key Component Features #### A. Fin Design This model utilizes a **High-Performance Fin** structure. The cross-cut pattern allows for air to enter from any direction, making it ideal for systems where the airflow path is not strictly linear. #### B. Attachment Mechanism: Push-Pin Instead of adhesives or clips, this heat sink uses a **Brass Push-Pin** with a compression spring. * **Benefits:** Provides uniform pressure across the component, ensuring maximum contact with the heat source. * **Stability:** Offers better mechanical reliability in high-vibration environments compared to thermal tape. #### C. Thermal Interface Material (TIM) It comes pre-applied with **T766**. This is a high-performance thermal pad or grease designed to fill microscopic air gaps between the CPU/GPU and the aluminum sink to minimize thermal resistance. --- ### 3. Thermal Performance Analysis The efficiency of the heat sink depends on the airflow (Measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (Unducted)** | 12.11 | | **300 (Unducted)** | 4.10 | | **500 (Unducted)** | 2.50 | --- ### 4. Typical Applications * **Integrated Circuits (ICs):** Cooling of Northbridge/Southbridge chips or FPGAs. * **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators. * **Embedded Systems:** Small form-factor PCs where height (15.24mm) is a constraint. ---