The **ATS-08H-75-C1-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance **Heat Sink** designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS. Below are the primary specifications for this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 25mm x 25mm x 30mm | | **Thermal Resistance** | 5.17 °C/W (at 100 LFM) | | **Airflow Pattern** | Vertical (Straight Fin) | | **Compliance** | RoHS Compliant | --- ### 2. Design and Engineering Features #### A. Fin Profile (Straight Fin) The "Straight Fin" design is optimized for environments where the airflow is predictable and unidirectional. This profile provides a large surface area for heat dissipation relative to its small 25x25mm footprint. #### B. pushPIN™ Attachment System This model utilizes the proprietary ATS pushPIN™ system, which includes: * **Pre-installed Springs:** Ensures consistent pressure (clamping force) on the electronic component for optimal thermal transfer. * **Plastic/Brass Push Pins:** Provides a secure mechanical connection to the PCB without the need for tools. #### C. Thermal Interface Material (TIM) The "C1" in the part number indicates that it typically comes with **T766 thermal grease** or a similar high-performance phase-change material pre-applied to the base, ensuring there are no air gaps between the heat sink and the chip. --- ### 3. Part Number Breakdown (Nomenclature) Understanding the code helps in identifying the exact variant: | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Manufacturer) | | **08** | Series Number | | **H** | High Performance | | **75** | Specific Design/Size Reference | | **C1** | Thermal Interface Material (TIM) Type | | **R0** | Revision/Finish Code (Blue Anodized) | --- ### 4. Applications This part is commonly used in: * **Telecommunications:** Cooling small form-factor pluggable modules. * **Embedded Systems:** Industrial PCs and automation controllers. * **Networking Gear:** Routers and switches where PCB space is limited but vertical clearance is available (30mm height).