The **ATS-08H-80-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). ### Technical Specifications This part is designed for surface-mount cooling applications, often used in networking, telecommunications, and industrial computing. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 1.90°C/W (at 100 LFM) | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Footprint (L x W)** | 30.00mm x 30.00mm | | **Height** | 15.00mm | --- ### Core Components & Design Features #### 1. Heat Sink Geometry (Fin Design) The "08H" series utilizes a **cross-cut** or **straight fin** design (depending on the specific pitch variant). This allows for multi-directional airflow, making it highly effective in compact enclosures where air may not flow in a perfectly linear path. #### 2. Attachment Mechanism: pushPIN™ Unlike adhesive-based heat sinks, the **R0** suffix indicates a push-pin attachment system. This provides: * **Mechanical Stability:** Higher pressure and more secure mounting than thermal tape. * **Uniform Pressure:** Ensures a consistent interface between the chip and the heat sink. * **Reusability:** Easy to remove for maintenance without damaging the PCB. #### 3. Thermal Interface Material (TIM) The **C2** designation typically refers to the pre-applied thermal interface material. * ATS uses high-performance phase-change or grease-based materials to fill microscopic air gaps between the electronic component (CPU, FPGA, or ASIC) and the aluminum base. #### 4. Material and Finish * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodized Coating:** Provides corrosion resistance and slightly improves radiative heat transfer. --- ### Application in Electronics This part is commonly found on: * **FPGAs & ASICs:** Used in data processing units. * **Power Modules:** To dissipate heat from high-current voltage regulators. * **Embedded Systems:** Where space is limited to a 30mm x 30mm footprint.