The **ATS-08H-83-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for efficient cooling of semiconductors and ICs. ### 1. Technical Specifications The following table highlights the core physical and thermal properties of this specific part number: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 16.03°C/W (Unducted @ 100 LFM) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 20.00mm | | **Fin Style** | Fine-Pitch | | **Pattern** | Square | --- ### 2. Key Design Components #### A. Fin Geometry This model features a **Fine-Pitch** design. High-density fins increase the surface area available for heat dissipation, making it ideal for high-heat density components where airflow might be slightly restricted. #### B. The pushPIN™ Attachment Unlike adhesive tapes or simple clips, the `pushPIN™` system uses: * **Brass/Steel Springs:** Provide precise, consistent pressure (preload) on the component. * **Plastic/Metal Push Pins:** Inserted through pre-drilled holes in the PCB for a secure mechanical lock. * **Reliability:** This prevents the heat sink from shifting during thermal expansion or vibration. #### C. Thermal Interface Material (TIM) The "R0" suffix generally indicates that the part comes with **T766** (or a similar high-performance) pre-applied phase-change thermal interface material. This ensures minimal thermal resistance between the chip surface and the aluminum base. --- ### 3. Application Use Cases The ATS-08H-83-C2-R0 is typically used in the following electronic environments: 1. **Telecommunications:** Cooling for FPGA or ASIC chips in networking switches. 2. **Power Electronics:** Dissipating heat from high-speed voltage regulators. 3. **Embedded Systems:** Cooling CPUs or GPUs on compact industrial motherboards. --- ### 4. Thermal Performance Comparison Thermal resistance varies based on airflow velocity (LFM - Linear Feet per Minute): | Airflow Velocity | 100 LFM | 300 LFM | 500 LFM | | :--- | :--- | :--- | :--- | | **Resistance (°C/W)** | 16.03 | 5.54 | 3.35 |