The **ATS-08H-92-C2-R0** is a specific model of a **High-Performance Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors. ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Specification | Details | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 40mm x 40mm x 15mm | | **Thermal Resistance** | 16.48°C/W (Unducted Flow @ 100 LFM) | | **Fin Style** | Straight Fin | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Breakdown of the Model Number Understanding the part number helps in identifying the specific version of the cooling solution: - **ATS-08**: Refers to the series/product line. - **H**: Usually indicates a high-profile or specific fin configuration. - **92**: Denotes the specific design or dimension code within the series. - **C2**: Refers to the color and finish (Blue Anodized). - **R0**: Revision code or specific packaging/material indicator. --- ### 3. Key Electronic Components Features This heat sink is an **active-passive** thermal management component. Its effectiveness is based on several electronic design factors: #### A. pushPIN™ Attachment System The part uses a specialized attachment system designed to provide: * **Constant Pressure:** Ensures the heat sink is pressed firmly against the electronic chip for maximum heat transfer. * **Secure Mounting:** Uses a spring-loaded mechanism to prevent the sink from shifting during vibration or transport. #### B. Thermal Interface Material (TIM) The "T766" listed in the specs is the material between the heat sink and the electronic part. It fills microscopic air gaps, which are poor conductors, significantly improving the thermal path from the component to the aluminum fins. #### C. Fin Optimization The straight-fin design is optimized for **forced air cooling**. In electronic enclosures where fans are present, the spacing between these fins allows for high-velocity air to pass through, carrying heat away from the sensitive silicon die. --- ### 4. Typical Applications * **Field Programmable Gate Arrays (FPGAs)** * **Microprocessors (CPUs)** * **Power Supply Units (PSUs)** * **High-speed Networking Switches**