ATS-08H-93-C2-R0
AI

The **ATS-08H-93-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to their "pushPIN™" line, designed for efficient cooling of integrated circuits (ICs) like CPUs, GPUs, and other heat-generating semiconductors.
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### 1. Technical Specifications
Below are the primary physical and thermal characteristics of this component:
| Specification | Details |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Fin Type** | Straight |
| **Attachment Method** | pushPIN™ (Spring-loaded pins) |
| **Dimensions (L x W x H)** | 40mm x 40mm x 30mm |
| **Thermal Resistance** | 0.73 °C/W (@ 500 LFM) |
| **Pitch** | Fine Pitch |
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### 2. Electronic/Thermal Performance
In electronics, thermal resistance is the most critical metric. This part is designed to dissipate heat from a component into the surrounding air.
* **Thermal Resistance (Low Airflow):** 7.37 °C/W at 100 LFM (Linear Feet per Minute).
* **Thermal Resistance (High Airflow):** 0.73 °C/W at 500 LFM.
* **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied, which is a high-efficiency phase-change material that improves the heat transfer between the chip and the heat sink.
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### 3. Key Electronic Features
* **PushPIN™ Attachment:** The "R0" designation refers to the specific attachment kit. It uses a flexible, spring-loaded mechanism that ensures even pressure across the electronic chip, preventing physical damage while maintaining constant thermal contact.
* **Fine-Pitch Fins:** The "93" in the model number refers to the fin pattern. It is designed for "ducted" or high-velocity airflow environments commonly found in 1U or 2U server racks.
* **EMI Shielding Compatibility:** Because it is made of aluminum, it does not interfere with electromagnetic signals, though its physical profile must be accounted for in RF-sensitive layouts.
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### 4. Part Number Breakdown
To understand what each part of the code means for an electronic designer:
`ATS - 08 H - 93 - C2 - R0`
1. **ATS:** Advanced Thermal Solutions (Manufacturer).
2. **08:** Series/Attachment type.
3. **H:** Fin height (High profile).
4. **93:** Specific fin geometry/pattern.
5. **C2:** Material/Finish (Aluminum / Blue Anodized).
6. **R0:** Packaging and Hardware kit version.
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What are the mounting hole dimensions for this specific heat sink?
- ⤷ How does the T766 thermal interface material compare to standard thermal paste?
- ⤷ Is this heat sink suitable for a natural convection (passive) cooling environment?