The **ATS-09B-08-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic packages. It is manufactured by *Advanced Thermal Solutions (ATS)*. --- ### 1. Key Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Property | Specification | | :--- | :--- | | **Product Type** | push-PIN™ HS Assembly | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 14.61°C/W (at 100 LFM) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Interface Material** | T766 (Thermal Interface Material pre-applied) | --- ### 2. Physical Dimensions The dimensions are critical for ensuring the heatsink fits the PCB layout and the specific electronic chip it is intended to cool. | Dimension | Value | | :--- | :--- | | **Length (A)** | 45.00 mm | | **Width (B)** | 45.00 mm | | **Height (C)** | 15.00 mm | | **Pitch (E)** | 38.00 mm (Distance between pins) | | **Pitch (F)** | 38.00 mm | --- ### 3. Electronic Design Features * **Fin Design (Square-Cut):** The "09" series typically utilizes a cross-cut or square-cut fin pattern. This design allows for multi-directional airflow, making it efficient in systems where air direction might change or is turbulent. * **Thermal Interface Material (TIM):** The **C2** designation indicates that it comes with a high-performance thermal pad (T766) pre-attached to the base. This ensures optimal heat transfer from the electronic component (like a CPU, GPU, or FPGA) to the aluminum fins. * **Mounting System:** The push-pin mechanism uses a compression spring. This provides consistent pressure across the chip surface, preventing air gaps and protecting the silicon die from uneven mechanical stress. --- ### 4. Application Use Cases This specific part is commonly found in: 1. **Networking Hardware:** Switches and routers where airflow is provided by chassis fans. 2. **Embedded Systems:** Industrial PCs where vertical clearance is limited (15mm height). 3. **Power Electronics:** Cooling MOSFET arrays or voltage regulators. ---