The **ATS-09B-101-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) and other surface-mount components. --- ### 1. Technical Specifications Below are the primary technical parameters for this specific part number: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Dimensions (L x W x H)** | 45mm x 45mm x 30mm | | **Thermal Resistance** | 6.77°C/W (Unducted Flow @ 100 LFM) | | **Fin Type** | Fine-Pitch (Straight) | --- ### 2. Breakdown of the Part Number The part number follows the standard ATS naming convention, which identifies the physical and thermal properties of the unit: * **ATS**: Manufacturer prefix. * **09B**: Series identifier (standard high-performance aluminum). * **101**: Specific model/design code within the series. * **C3**: Indicates the **Thermal Interface Material (TIM)** and hardware color. "C3" typically refers to a pre-applied high-performance thermal pad. * **R0**: RoHS compliance status and revision version. --- ### 3. Key Electronic Functions While the heat sink itself is passive (it does not require electricity to run), it performs several critical functions for electronic assemblies: 1. **Heat Dissipation:** It increases the surface area of a hot component (like a CPU, FPGA, or MOSFET), allowing air to carry away heat more efficiently. 2. **Thermal Protection:** By keeping the junction temperature ($T_j$) below the manufacturer's limit, it prevents **Thermal Throttling** and permanent hardware failure. 3. **Mechanical Stability:** The "Push-Pin" design provides a consistent compression force against the electronic component, ensuring the thermal interface material fills all microscopic gaps for maximum heat transfer. --- ### 4. Component Comparison: Airflow vs. Resistance The performance of this part depends heavily on the airflow (measured in Linear Feet per Minute - LFM). | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 6.77 | | 200 (1.0 m/s) | 2.32 | | 400 (2.0 m/s) | 1.35 | | 600 (3.0 m/s) | 1.01 | ---