The **ATS-09B-35-C2-R0** is a high-performance electronic thermal management component, specifically an **Aluminum Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for cooling integrated circuits (ICs) and surface-mount devices. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded bolts) | | **Thermal Resistance** | 12.48 °C/W (at 100 LFM) | | **Dimensions (L x W)** | 35.00 mm x 35.00 mm | | **Height** | 10.00 mm | | **Pitch / Pattern** | Fine Pitch (Straight Fin) | --- ### 2. Design Components The assembly consists of three critical electronic/mechanical sub-parts: 1. **The Heat Sink Body:** A square aluminum block with a "Fine Pitch" straight fin design. This maximizes surface area for heat dissipation into the surrounding air. 2. **The Push-Pins:** These are the mounting hardware. They come in various materials (usually plastic or brass) and are designed to provide a specific amount of tension to ensure the heat sink remains in contact with the component. 3. **The Spring:** Each push-pin is equipped with a compression spring. This ensures a consistent "force" (pressure) is applied to the **Thermal Interface Material (TIM)**, which is essential for efficient heat transfer from the chip to the aluminum. --- ### 3. Thermal Performance Data Thermal resistance measures how effectively the part moves heat away from the electronics. Lower values are better. | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (0.5 m/s)** | 12.48 | | **300 (1.5 m/s)** | 3.86 | | **500 (2.5 m/s)** | 2.59 | | **700 (3.5 m/s)** | 2.03 | --- ### 4. Key Electronic Applications This part is typically found in the following electronic environments: * **Networking Hardware:** Switches, routers, and high-speed modems. * **Power Supplies:** Cooling MOSFETs or voltage regulators. * **Embedded Systems:** Single-board computers where vertical space is limited (due to its low 10mm profile). * **GPU/CPU Support:** Cooling auxiliary chips on a motherboard or graphics card.