The **ATS-09B-52-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for precision cooling of electronic components like CPUs, GPUs, or power modules. ### 1. Key Technical Specifications Below are the primary physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Fin Type** | Fine Pitch (Straight Fin) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 10.79° C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 30mm x 30mm x 25mm | | **Compliance** | RoHS Compliant | --- ### 2. Functional Components The "electronic" utility of this part is derived from its mechanical design to protect semiconductor junctions: * **Heat Sink Body:** Extruded aluminum with a high surface-area-to-volume ratio. The 25mm height allows for significant heat dissipation in compact enclosures. * **Push-Pin Attachment:** Features a flexible, brass-tipped or plastic push-pin mechanism. This ensures constant pressure against the electronic chip, which is critical for maximizing the effectiveness of the Thermal Interface Material (TIM). * **Compression Springs:** These provide a specific "Force" rating (measured in Newtons) to ensure the heat sink does not move during mechanical shock or vibration, protecting the delicate solder balls under a BGA (Ball Grid Array) chip. ### 3. Thermal Performance Metrics The efficiency of this part is measured by its ability to move heat away from the silicon die. Thermal resistance decreases as airflow increases: | Airflow Velocity (LFM) | 100 (0.5 m/s) | 300 (1.5 m/s) | 500 (2.5 m/s) | | :--- | :--- | :--- | :--- | | **Thermal Resistance (°C/W)** | 10.79 | 4.15 | 3.00 | --- ### 4. Part Number Breakdown: `ATS-09B-52-C2-R0` * **ATS:** Manufacturer (Advanced Thermal Solutions). * **09:** Part of the specific pushPIN™ family. * **B:** Material/Fin orientation code. * **52:** Specific height and fin density configuration. * **C2:** Thermal Interface Material (TIM) type (T766) and finish (Blue Anodized). * **R0:** Revision code.