The **ATS-09B-63-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, engineered to provide efficient cooling for electronic components like CPUs, GPUs, or power transistors. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Spring-loaded) | | **Thermal Resistance** | 1.59°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 20.00mm | | **Fin Style** | Straight Fin | --- ### Key Electronic & Mechanical Components #### 1. The Heatsink Body (Alloy 6063) The main body is constructed from Aluminum 6063. This alloy is chosen for its excellent thermal conductivity and structural integrity. The **Blue Anodized** coating is not just for aesthetics; it increases surface emissivity and protects the aluminum from corrosion. #### 2. Push Pin Attachment System The "09B" designation typically refers to the specific push-pin hardware. This system replaces traditional adhesives or screws: * **Compression Springs:** These provide consistent downward pressure (load) to ensure the heatsink maintains a tight interface with the electronic chip. * **Brass/Plastic Pins:** These lock into pre-drilled holes on the PCB (Printed Circuit Board). #### 3. Thermal Interface Material (TIM) The "C2" suffix indicates that the heatsink comes pre-applied with **T766 thermal phase change material**. * **Function:** It fills microscopic air gaps between the heatsink base and the electronic component, significantly reducing thermal resistance. --- ### Performance Data (Airflow) | Air Velocity (LFM) | 100 | 200 | 300 | 400 | 500 | | :--- | :--- | :--- | :--- | :--- | :--- | | **Thermal Resistance (°C/W)** | 1.59 | 0.92 | 0.74 | 0.64 | 0.58 | --- ### Application Usage This part is commonly used in: * **Telecommunications:** Cooling of high-speed processors. * **Industrial Electronics:** Managing heat in power supply modules. * **Embedded Systems:** Ensuring stability in compact enclosures where airflow might be limited.