The **ATS-09B-72-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **blueICE™** series and is designed for high-efficiency cooling of integrated circuits (ICs) and other electronic surface-mount components. --- ### 1. Technical Specifications Below are the primary mechanical and thermal characteristics of this specific model: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 15.00mm | | **Fin Style** | Straight (High-flow) | | **Thermal Resistance** | 5.11°C/W (at 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Detailed Component Breakdown #### A. The pushPIN™ Attachment System One of the defining electronic/mechanical features of this part is the **pushPIN™** system. Unlike adhesive-based heat sinks, this uses: * **Compression Springs:** Provides specific pressure to ensure maximum contact between the chip and the heat sink. * **Brass/Plastic Pins:** Secure the unit to the PCB through pre-drilled holes, preventing the heat sink from shifting during vibration or shipping. #### B. Thermal Performance The "72" in the part number corresponds to a specific fin configuration designed for **forced air cooling**. * **Low Pressure Drop:** The straight fin design allows air to pass through with minimal resistance, which is critical for densely packed electronic enclosures. * **Efficiency:** At high airflows (e.g., 500 LFM), the thermal resistance drops significantly (approx. 1.50°C/W), allowing for cooling of high-wattage components. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied. This is a high-performance phase-change material or thermal pad that fills microscopic air gaps between the component (CPU/GPU/FPGA) and the aluminum base, ensuring optimal heat transfer. --- ### 3. Typical Applications This part is commonly found in the following electronic sectors: * **Telecommunications:** High-speed routers and switches. * **Embedded Systems:** Industrial PC boards. * **Power Supplies:** Cooling MOSFETs or power ICs. * **Automotive:** Electronic Control Units (ECUs). ---