The **ATS-09B-75-C3-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. ### 1. Technical Specifications This part belongs to the **pushPIN™** series from Advanced Thermal Solutions (ATS). Below are the key physical and thermal characteristics: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Base Part Number** | ATS-09B-75 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 25mm x 25mm x 30mm | | **Fin Style** | Straight (Cross-Cut) | --- ### 2. Electronic Cooling Performance Thermal resistance is the most critical metric for this part, determining how effectively it moves heat away from the silicon die. * **Thermal Resistance (Unducted):** 5.30 °C/W @ 100 LFM * **Thermal Resistance (Ducted):** 1.25 °C/W @ 100 LFM * **Thermal Interface Material (TIM):** T412 (A high-performance thermal pad/grease pre-applied to the base). ### 3. Key Components of the Part Number The nomenclature "ATS-09B-75-C3-R0" breaks down as follows: 1. **ATS-09**: Designates the specific fin geometry and series. 2. **B**: Indicates the material (Aluminum). 3. **75**: Internal code for the specific height/width combination. 4. **C3**: Refers to the **Blue Anodized** finish and the specific spring/attachment force. 5. **R0**: Indicates the revision or packaging standard. --- ### 4. Application in Electronics This heatsink is typically found in: * **Network Switches/Routers:** Cooling high-speed processors. * **Embedded Systems:** For compact PCBs where vertical space allows for a 30mm height. * **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators. ### 5. Installation Diagram (Conceptual) ```text [ Push-Pin ] <-- Secure attachment through PCB holes | | +-----+----+-----+ | FIN STACK | <-- 25mm x 25mm surface area +----------------+ | BASE | <-- T412 Thermal Interface Material +----------------+ [ IC ] <-- Heat Source (CPU/FPGA) ```