The **ATS-09B-76-C2-R0** is a high-performance electronic thermal management component. Specifically, it is an **Advanced Thermal Solutions (ATS)** push-pin heat sink designed for cooling integrated circuits (ICs) on printed circuit boards (PCBs). --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 25mm x 25mm x 15mm | | **Thermal Resistance** | 11.50°C/W (at 200 LFM) | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Interface Material** | T766 (Phase Change Material) | --- ### 2. Component Breakdown #### A. The Heat Sink (Thermal Dissipator) The core of the unit is a **straight-fin heat sink**. - **Efficiency:** The fin geometry is optimized for high-performance airflow. - **Material:** Aluminum provides a lightweight profile with high thermal conductivity. - **Coating:** The "Blue Anodized" finish is not just aesthetic; it provides surface protection and slightly increases emissivity for better radiation. #### B. The Push-Pin Mechanism Unlike adhesive-based heat sinks, the **ATS-09B-76-C2-R0** uses a mechanical attachment system: - **Push-Pins:** Plastic pins that snap into pre-drilled holes (approx. 3mm) on the PCB. - **Springs:** Brass or steel compression springs provide consistent downward pressure on the processor. This ensures a tight thermal contact that won't degrade over time due to heat cycles. #### C. Thermal Interface Material (TIM) The part comes pre-applied with **T766 thermal grease/pad**. - **Function:** It fills the microscopic air gaps between the chip surface and the heat sink base. - **Benefit:** Pre-application ensures an even layer, reducing the risk of "hot spots" during installation. --- ### 3. Part Number Decoding The part number follows a specific logic: * **ATS:** Advanced Thermal Solutions (Manufacturer) * **09B:** Product Series/Family * **76:** Specific internal design/size code * **C2:** Blue Anodized finish * **R0:** RoHS Compliance status --- ### 4. Application Use-Cases This component is typically found in: 1. **Networking Hardware:** Switches, routers, and gateways. 2. **Embedded Systems:** Industrial PCs and controllers. 3. **High-Speed Computing:** FPGA and ASIC cooling where high reliability is required.