The **ATS-09B-83-C2-R0** is a high-performance electronic thermal management component, specifically an aluminum heat sink designed for cooling integrated circuits (ICs) and other electronic components. ### 1. Technical Specifications This part belongs to the **pushPIN™** series by Advanced Thermal Solutions (ATS). | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Part Number** | ATS-09B-83-C2-R0 | | **Material** | Aluminum (AL6063) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Fin Style** | Straight Fin | | **Dimensions** | 30.00mm x 30.00mm | | **Height (Off Base)** | 20.00mm | | **Thermal Resistance** | 1.62 °C/W (at 200 LFM) | | **Finish** | Blue Anodized | --- ### 2. Design and Functional Elements #### A. Fin Geometry The "Straight Fin" design is optimized for unidirectional airflow. It provides a large surface area to dissipate heat from the component into the surrounding air, typically found in server racks or forced-convection environments. #### B. Thermal Interface Material (TIM) The "C2" suffix in the part number indicates that the heat sink comes pre-applied with **T766 Phase Change Material**. This ensures a low-resistance thermal path between the chip surface and the aluminum base without requiring separate thermal paste. #### C. pushPIN™ Attachment System Instead of using adhesive tapes or simple clips, this model uses a specialized mechanical attachment: * **Brass Components:** High-durability pins. * **Compression Springs:** These provide precise, uniform pressure (load) across the chip surface to maximize heat transfer and prevent damage to the PCB. --- ### 3. Application Use Cases This specific size (30mm x 30mm) is commonly used for: * **FPGAs and ASICs:** High-speed processing units that generate significant localized heat. * **Network Switches:** Cooling for Ethernet controllers. * **Embedded Systems:** Industrial PCs where mechanical stability (vibration resistance) is required. --- ### 4. Thermal Performance Comparison *Under typical airflow conditions (Linear Feet per Minute):* ```text LFM (Airflow) | Thermal Resistance (°C/W) ------------------------------------------ 200 (1.0 m/s) | 1.62 400 (2.0 m/s) | 1.13 600 (3.0 m/s) | 0.95 ```