The **ATS-09B-87-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions, Inc. (ATS)**. It is part of the "push-pin" series designed for cooling electronic components such as CPUs, GPUs, and other high-heat-generating ICs. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Mounting Type** | Push-Pin (Plastic) | | **Thermal Resistance** | 1.31°C/W @ 200 LFM | | **Fin Style** | Straight (High-density) | | **Dimensions (L x W x H)** | 35mm x 35mm x 20mm | | **TIM (Thermal Interface Material)** | T766 (Pre-applied) | --- ### Key Electronic Components & Design Elements #### 1. Thermal Interface Material (T766) The "C2" in the part number indicates the specific thermal interface material. * **Function:** It fills microscopic air gaps between the chip surface and the heat sink base. * **Property:** T766 is a high-performance phase-change or grease-like material that ensures maximum heat transfer from the electronic component to the aluminum fins. #### 2. Push-Pin Attachment Mechanism Instead of adhesive tapes which can fail under high heat, this part uses a mechanical attachment system. * **Components:** Plastic push-pins and a stainless steel spring. * **Benefit:** The spring provides **consistent pressure**, which is critical for maintaining thermal contact over the lifespan of the electronic device. #### 3. Fin Geometry (Straight Fin) * **Airflow:** Designed for systems with dedicated cooling fans. * **Efficiency:** The high-density fin arrangement increases the surface area, allowing for rapid dissipation of heat into the ambient air via convection. #### 4. Blue Anodized Coating * **Corrosion Resistance:** Protects the aluminum from oxidation. * **Emissivity:** The anodized surface slightly improves the radiant heat transfer compared to raw aluminum. --- ### Typical Applications * **Microprocessors:** Cooling central units in embedded systems. * **FPGA & ASICs:** Managing heat in high-speed networking equipment. * **Power Supplies:** Dissipating heat from power transistors or VRMs (Voltage Regulator Modules).