The **ATS-09D-101-C3-R0** is a high-performance electronic thermal management component, specifically a **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number itself follows a specific nomenclature that defines its physical and thermal characteristics. | Specification | Details | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ HS | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 6.70°C/W (Unducted Flow @ 100 LFM) | | **Dimensions** | 45mm x 45mm x 30mm | --- ### 2. Physical Design Features The design of this part is optimized for airflow efficiency and ease of assembly: * **Fin Type:** It features a **Straight Fin** pattern. This is ideal for systems where the airflow direction is consistent and predictable. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T412**, a high-performance thermal tape or grease, ensuring a low-resistance path between the chip and the aluminum. * **The Push-Pin System:** Instead of using messy adhesives or complex brackets, it uses a spring-loaded push-pin mechanism. This provides consistent pressure (preload) for better thermal contact and allows for easy removal/rework. --- ### 3. Electronic Application The ATS-09D-101-C3-R0 is an **Active/Passive Cooling** component used to prevent "Thermal Throttling" or hardware failure in electronic systems. #### Key Roles: 1. **Heat Dissipation:** It increases the surface area of the electronic component, allowing the surrounding air to carry away heat more effectively. 2. **Reliability:** By maintaining a lower junction temperature ($T_j$), it extends the lifespan of the semiconductor. 3. **Space Efficiency:** With a 30mm height, it is designed for standard rack-mount or desktop enclosures where vertical space is available but limited. --- ### 4. Thermal Performance Comparison Thermal resistance is measured in °C/W (degrees Celsius per Watt). A lower number is better. | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 6.70 | | 300 (1.5 m/s) | 2.50 | | 500 (2.5 m/s) | 1.70 | ---