The **ATS-09D-147-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heatsink**. It is designed to cool electronic components like CPUs, GPUs, or FPGAs by dissipating heat into the surrounding air. --- ### Technical Specifications The following table summarizes the key physical and thermal properties of this part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-09D-147-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Base Dimensions** | 35mm x 35mm | | **Height** | 10mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | ~13.52°C/W (at 1.0 m/s airflow) | --- ### Key Electronic Components & Features #### 1. Heat Sink Body (The "Radiator") * **Material:** Made from high-grade aluminum. Aluminum is preferred in electronics for its excellent thermal conductivity-to-weight ratio. * **Anodization:** The "C2" in the part number refers to the **Blue Anodized** finish. This layer provides corrosion resistance and slightly increases emissivity for better radiant cooling. #### 2. Mechanical Attachment (Push-Pins & Springs) * **Push-Pin Mechanism:** This part uses a specialized push-pin system for mounting. * **Spring-Loaded:** The pins include springs that provide a consistent "clamping force" against the electronic chip. This ensures the best possible contact between the chip and the heatsink, reducing thermal resistance. #### 3. Thermal Interface Material (TIM) * The "-R0" suffix usually indicates that the unit comes pre-applied with a **Phase Change Material (PCM)** or high-performance thermal tape/grease on the base. This fills microscopic air gaps between the component and the heatsink. --- ### Thermal Performance Profile Thermal resistance determines how effectively the part removes heat. As airflow (LFM - Linear Feet per Minute) increases, the resistance drops: | Airflow Velocity | Thermal Resistance (°C/W) | | :--- | :--- | | Unducted (0.5 m/s) | 13.52 | | Ducted (1.0 m/s) | 7.53 | | Ducted (2.0 m/s) | 5.03 | --- ### Application in Circuitry This component is typically found on **Printed Circuit Boards (PCBs)** where a specific integrated circuit (IC) is generating more heat than it can dissipate through the board layers. It is common in: * Network switches and routers. * Industrial power supplies. * Embedded computing modules.