The **ATS-09D-33-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. Below is a detailed breakdown of its technical specifications and physical characteristics. --- ### 1. Technical Specifications | Feature | Description | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (with springs) | | **Thermal Resistance** | 17.42°C/W (Unducted Flow @ 100 LFM) | | **Shape** | Square, Fine Pitch Fins | ### 2. Physical Dimensions The dimensions are critical for ensuring the part fits on a Printed Circuit Board (PCB) without interfering with adjacent components. * **Length:** 35.00 mm * **Width:** 35.00 mm * **Height:** 20.00 mm * **Hole Spacing:** 40.00 mm (diagonal/spacing between pins) ### 3. Key Features * **pushPIN™ Attachment:** This system uses a flexible, spring-loaded mechanism that ensures a secure fit and constant pressure on the chip, improving heat transfer. * **Blue Anodized Finish:** This is not just for aesthetics; the anodization protects the aluminum from corrosion and slightly increases surface emissivity for better radiation cooling. * **Pre-applied Thermal Interface Material (TIM):** This specific model typically comes with **T766** thermal tape or grease pre-applied to the base, simplifying the installation process. ### 4. Thermal Performance The efficiency of this heatsink depends on the airflow (measured in Linear Feet per Minute - LFM) within the device enclosure: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 17.42 | | 300 (1.5 m/s) | 5.40 | | 500 (2.5 m/s) | 3.66 | --- ### Use Case This part is commonly used on **BGAs (Ball Grid Arrays)**, **CPUs**, and **GPUs** in telecommunications, networking, and industrial computing where vertical space allows for a 20mm height.