The **ATS-09D-40-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Thermal Resistance** | 14.56°C/W (undirected) to 1.21°C/W (at high airflow) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded plastic pins) | | **Dimensions** | 45mm x 45mm x 25mm | --- ### 2. Breakdown of the Part Number The alphanumeric code provides specific details about the component's geometry and material properties: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **09**: Fin pattern and geometry specific to the series. * **D**: Material type (typically signifies the fin pitch or specific series variation). * **40**: Dimensions (referencing the square footprint). * **C2**: Indicates the thermal performance and material grade (Aluminum 6063). * **R0**: RoHS compliance status and version. --- ### 3. Key Electronic Functions While the heat sink itself is a passive mechanical part, its role in an electronic system is critical: * **Thermal Dissipation**: It increases the surface area of the heat-generating component, allowing heat to transfer into the ambient air via convection. * **pushPIN™ Attachment**: This specific model uses a specialized attachment system that includes a copper/stainless steel spring. This ensures even pressure across the semiconductor die, preventing damage and maximizing thermal transfer. * **Airflow Optimization**: The "Fine Pitch" design is optimized for environments with forced air (fans), providing a low pressure drop. --- ### 4. Application Environments This part is commonly found in the following electronic assemblies: 1. **Telecommunications**: High-speed routers and switches. 2. **Industrial PCs**: Embedded systems that require high reliability in warm environments. 3. **Power Electronics**: Voltage regulators and power converters that generate significant waste heat.