The **ATS-09D-52-C2-R0** is a specific part number for a high-performance **Heatsink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **blueICE™** series, specifically designed for cooling electronic components like CPUs, GPUs, and FPGAs. ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-09D-52-C2-R0 | | **Thermal Resistance** | 10.79°C/W (at 1.0 m/s airflow) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions** | 45mm x 45mm x 25mm | | **Fin Style** | Fine Pitch (Straight Fin) | --- ### Key Electronic Components & Features #### 1. The pushPIN™ Attachment System The "R0" suffix refers to the specific attachment kit. This model uses a **pushPIN™** system which includes: * **Compression Springs:** Provides precise pressure (Force) to ensure maximum contact between the heatsink base and the electronic chip. * **Plastic/Brass Pins:** Designed to fit into pre-drilled holes (usually 3.175mm) on the PCB. #### 2. Thermal Interface Material (TIM) This part comes pre-applied with **ATS-CPX-700**, a high-performance Phase Change Material. * **Function:** It fills microscopic air gaps between the heatsink and the component to improve heat transfer. #### 3. Material Properties * **Aluminum 6063:** Used for its excellent thermal conductivity and lightweight properties. * **Blue Anodization:** This is not just for aesthetics; the anodized layer provides increased surface emissivity and protects the aluminum from corrosion. --- ### Application in Electronics This heatsink is typically used in the following scenarios: * **Telecommunications:** Cooling high-speed networking processors. * **Embedded Systems:** For industrial computers where passive or low-airflow cooling is required. * **Power Electronics:** Dissipating heat from high-wattage voltage regulators.