ATS-09D-83-C2-R0
AI

The part number **ATS-09D-83-C2-R0** refers to a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their *push-pin* attachment series, specifically designed for cooling electronic components like CPUs, GPUs, or high-power ASICs.
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### 1. Technical Specifications
Below is a breakdown of the primary technical characteristics for this specific model:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic) |
| **Spring Type** | Compression Spring |
| **Fin Type** | Straight Fin |
| **Thermal Resistance** | ~2.02°C/W (at 200 LFM) |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### 2. Physical Dimensions
The dimensions are critical for ensuring the part fits within the PCB layout constraints:
* **Size (L x W):** 30mm x 30mm
* **Height:** 20mm
* **Mounting Hole Pitch:** 35mm (diagonal/standard for this footprint)
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### 3. Component Breakdown
The part assembly consists of several electronic-mechanical sub-components:
#### A. The Heatsink Body
Made from extruded aluminum. The **Blue Anodized** coating is not just for aesthetics; it provides surface protection and slightly improves emissivity (heat radiation) compared to bare aluminum.
#### B. Push-Pin Mounting System
This model uses a **plastic push-pin** with a **compression spring**. This design ensures:
* **Constant Pressure:** Maintains a secure contact between the heatsink base and the chip.
* **Vibration Resistance:** Prevents the cooler from shifting during shipping or operation.
#### C. Thermal Interface Material (TIM)
The "C2" in the part number indicates it comes with **T766 phase-change material** or a high-performance thermal pad pre-applied to the bottom. This fills microscopic air gaps between the component and the heatsink to maximize heat transfer.
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### 4. Part Number Decoder (Breakdown)
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer: Advanced Thermal Solutions |
| **09** | Part Series (Standard Push-Pin) |
| **D** | Material/Attachment variable |
| **83** | Specific Die/Fin Geometry |
| **C2** | Thermal Interface Material (TIM) code |
| **R0** | RoHS Compliant version |
- ⤷
What are the airflow requirements to achieve optimal cooling with this heatsink?
- ⤷ Does this model support mounting on PCBs with different hole diameters?
- ⤷ What is the weight of this component for vibration analysis?