The **ATS-09D-85-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for secure and efficient cooling of integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the key technical parameters for this specific part number: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 23.98 °C/W (at 100 LFM) | | **Dimensions (L x W)** | 35mm x 35mm | | **Height** | 10mm | | **Fin Style** | Straight Fin | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the component's features: - **ATS**: Manufacturer (Advanced Thermal Solutions). - **09**: Series number (pushPIN™ Heat Sink). - **D**: Material/Color code (Aluminum, Blue Anodized). - **85**: Specific dimension profile. - **C2**: Thermal Performance Grade / Mounting Hardware. - **R0**: Revision/Packaging code. --- ### 3. Key Electronic/Physical Features - **Thermal Performance**: The 10mm low-profile design is optimized for airflow within tight enclosures. The "Straight Fin" design allows for efficient heat dissipation when combined with directional fan cooling. - **Mechanical Stability**: The pushPIN™ system utilizes a flexible, spring-loaded mechanism. This ensures consistent pressure between the heatsink and the electronic component, preventing damage from vibration or thermal expansion. - **Pre-applied TIM**: It comes with **T766** thermal grease already applied to the base. This ensures maximum heat transfer from the electronic chip to the aluminum fins without the user needing to apply external paste. - **Material Durability**: The blue anodized finish provides a protective layer against environmental corrosion and improves emissivity for better radiant heat transfer. --- ### 4. Typical Applications This component is generally used on Printed Circuit Boards (PCBs) for: 1. **Network Switches/Routers**: Cooling high-speed processing chips. 2. **Embedded Systems**: Heat management for industrial computer modules. 3. **Power Supplies**: Dissipating heat from MOSFETs or voltage regulators.