The **ATS-09D-87-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The following table summarizes the physical and thermal properties of this specific part number: | Property | Description | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 2.72°C/W (at 100 LFM) | | **Dimensions (L x W)** | 35mm x 35mm | | **Height** | 20mm | | **Fin Style** | Straight (High-flow design) | --- ### 2. Design Characteristics The part number follows a specific nomenclature used by ATS to describe its features: * **ATS-09**: Represents the series family. * **D**: Refers to the fin pitch (often "Dense" or a specific pattern). * **87**: The specific design iteration or model size. * **C2**: Indicates the material and finish (C2 usually denotes **Blue Anodized Aluminum**). * **R0**: Refers to the revision and packaging type. --- ### 3. Key Electronic Functions While the heat sink itself is passive (no moving parts), it performs critical roles in an electronic circuit: 1. **Heat Dissipation:** It increases the surface area of the component it is attached to, allowing air to carry away heat via convection. 2. **Reliability:** By maintaining a lower operating temperature, it prevents "thermal throttling" in processors and extends the Mean Time Between Failures (MTBF) of the silicon. 3. **Mechanical Attachment:** The **push-pin** mechanism ensures a consistent "Normal Force" is applied to the thermal interface material (TIM), ensuring optimal thermal conductivity between the chip and the aluminum. --- ### 4. Application Use-Cases * **Embedded Systems:** Used on motherboards for networking gear. * **Power Supplies:** Cooling MOSFETs or Voltage Regulators. * **Industrial PCs:** Where space is limited but high thermal efficiency is required.